Electronic Equipment

Browse our inventory of electronic equipment. You can search using our search tool to the right. and add the specific equipment to “My Equipment List” and hit the “Request Info” button. We will then reach out to you to you as soon as possible.

Model name: 2000D | Manufacturer: HANMIi

RMMT20473

  • Model Name: 2000D
  • Wafer Size: N/A
  • Serial Number: MSA-667/KU1162
  • Date Available: 14/12/2022
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Integrated Saw/Singulation System
  • Manufacturer: HANMI
  • Location: TAIWAN

Model name: 2000D | Manufacturer: HANMIi

RMMT20596

  • Model Name: 2000D
  • Wafer Size: N/A
  • Serial Number: MSA-A812/KU1170
  • Date Available: 30/01/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Integrated Saw/Singulation System
  • Manufacturer: HANMI
  • Location: SINGAPORE

Model name: 2300 Flex FXP | Manufacturer: Lam Researchi

RMMT21127

  • Model Name: 2300 Flex FXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex FXP | Manufacturer: Lam Researchi

RMMT21144

  • Model Name: 2300 Flex FXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/12/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21014

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 30/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: ACT 12 SOD | Manufacturer: TELi

RMMT20271

  • Model Name: ACT 12 SOD
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 31/07/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Resist Processing Equipment
  • Type: Cluster Tool Tracks (Resist Coater/Developer)
  • Manufacturer: TEL
  • Location: SINGAPORE

Model name: ACT 12 SOD | Manufacturer: TELi

RMMT20234

  • Model Name: ACT 12 SOD
  • Wafer Size: 300
  • Serial Number: J171778
  • Date Available: 31/07/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Resist Processing Equipment
  • Type: Cluster Tool Tracks (Resist Coater/Developer)
  • Manufacturer: TEL
  • Location: SINGAPORE

Model name: ACT 12 SOD | Manufacturer: TELi

RMMT20175

  • Model Name: ACT 12 SOD
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Resist Processing Equipment
  • Type: Cluster Tool Tracks (Resist Coater)
  • Manufacturer: TEL
  • Location: SINGAPORE

Model name: ACT 12 SOD | Manufacturer: TELi

RMMT21128

  • Model Name: ACT 12 SOD
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Resist Processing Equipment
  • Type: Cluster Tool Tracks (Resist Coater)
  • Manufacturer: TEL
  • Location: SINGAPORE

Model name: Altus Max | Manufacturer: Lam Researchi

RMMT21075

  • Model Name: Altus Max
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/12/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Deposition Equipment
  • Type: Metal CVD (Chemical Vapor Deposition)
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: Archer 300 Plus | Manufacturer: KLA-Tencori

RMMT21126

  • Model Name: Archer 300 Plus
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Metrology Equipment
  • Type: Overlay Measurement System
  • Manufacturer: KLA-Tencor
  • Location: SINGAPORE

Model name: Atlas M | Manufacturer: IXRF Systemsi

RMMT21008

  • Model Name: Atlas M
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: X-Ray Inspection Equipment
  • Type: Automatic X-Ray Inspection System
  • Manufacturer: IXRF Systems
  • Location: SINGAPORE

Model name: Atlas M | Manufacturer: IXRF Systemsi

RMMT21009

  • Model Name: Atlas M
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: X-Ray Inspection Equipment
  • Type: Automatic X-Ray Inspection System
  • Manufacturer: IXRF Systems
  • Location: SINGAPORE

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20734

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20735

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20736

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20737

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20738

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20763

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Centris G5 Mesa | Manufacturer: Applied Materialsi

RMMT20687

  • Model Name: Centris G5 Mesa
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 14/09/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Applied Materials
  • Location: SINGAPORE