Electronic Equipment

Browse our inventory of electronic equipment. You can search using our search tool to the right. and add the specific equipment to “My Equipment List” and hit the “Request Info” button. We will then reach out to you to you as soon as possible.

Model name: 2000D | Manufacturer: HANMIi

RMMT20473

  • Model Name: 2000D
  • Wafer Size: N/A
  • Serial Number: MSA-667/KU1162
  • Date Available: 14/12/2022
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Integrated Saw/Singulation System
  • Manufacturer: HANMI
  • Location: TAIWAN

Model name: 2000D | Manufacturer: HANMIi

RMMT20596

  • Model Name: 2000D
  • Wafer Size: N/A
  • Serial Number: MSA-A812/KU1170
  • Date Available: 30/01/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Integrated Saw/Singulation System
  • Manufacturer: HANMI
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT20979

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 09/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21006

  • Model Name: 2300 Flex HXP
  • Wafer Size: 200
  • Serial Number: TBD
  • Date Available: 30/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21013

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 30/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21014

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 30/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21015

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 30/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 4072A | Manufacturer: Keysighti

RMMT20600

  • Model Name: 4072A
  • Wafer Size: N/A
  • Serial Number: JP10Q00126
  • Date Available: 23/02/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Parametric Test Equipment
  • Type: Semiconductor Parametric Analyzer
  • Manufacturer: Keysight
  • Location: SINGAPORE

Model name: 4072F | Manufacturer: Keysighti

RMMT20712

  • Model Name: 4072F
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 04/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Parametric Test Equipment
  • Type: Semiconductor Parametric Analyzer
  • Manufacturer: Keysight
  • Location: SINGAPORE

Model name: AXI-940B | Manufacturer: Onto Innovationsi

RMMT20668

  • Model Name: AXI-940B
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 08/08/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Metrology Equipment
  • Type: Thin Film Measurement System
  • Manufacturer: Onto Innovations
  • Location:

Model name: AXI-940B | Manufacturer: Onto Innovationsi

RMMT20669

  • Model Name: AXI-940B
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 08/08/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Metrology Equipment
  • Type: Thin Film Measurement System
  • Manufacturer: Onto Innovations
  • Location: SINGAPORE

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20734

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20735

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20736

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20737

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20738

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: Bestem D531t | Manufacturer: Canon Machineryi

RMMT20763

  • Model Name: Bestem D531t
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA

Model name: BSM-263G | Manufacturer: EO Technicsi

RMMT20850

  • Model Name: BSM-263G
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Marking Equipment
  • Type: Laser Marker
  • Manufacturer: EO Technics
  • Location: SINGAPORE

Model name: Centris G5 Mesa | Manufacturer: Applied Materialsi

RMMT20687

  • Model Name: Centris G5 Mesa
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 14/09/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Applied Materials
  • Location: SINGAPORE

Model name: DFD6361 | Manufacturer: Discoi

RMMT20733

  • Model Name: DFD6361
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Dicing Saw
  • Manufacturer: Disco
  • Location: SINGAPORE