Electronic Equipment

Browse our inventory of electronic equipment. You can search using our search tool to the right. and add the specific equipment to “My Equipment List” and hit the “Request Info” button. We will then reach out to you to you as soon as possible.

Model name: 2000D | Manufacturer: HANMIi

RMMT20473

  • Model Name: 2000D
  • Wafer Size: N/A
  • Serial Number: MSA-667/KU1162
  • Date Available: 14/12/2022
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Integrated Saw/Singulation System
  • Manufacturer: HANMI
  • Location: TAIWAN

Model name: 2000D | Manufacturer: HANMIi

RMMT20596

  • Model Name: 2000D
  • Wafer Size: N/A
  • Serial Number: MSA-A812/KU1170
  • Date Available: 30/01/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Integrated Saw/Singulation System
  • Manufacturer: HANMI
  • Location: SINGAPORE

Model name: 2300 Exelan | Manufacturer: Lam Researchi

RMMT20713

  • Model Name: 2300 Exelan
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 01/05/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex FXP | Manufacturer: Lam Researchi

RMMT21127

  • Model Name: 2300 Flex FXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex FXP | Manufacturer: Lam Researchi

RMMT21144

  • Model Name: 2300 Flex FXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/12/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex FXP | Manufacturer: Lam Researchi

RMMT21246

  • Model Name: 2300 Flex FXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21014

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 02/21/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT20057

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 21/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT20265

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 21/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21015

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 30/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21201

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21202

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location:

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21203

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21204

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21211

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21214

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21215

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21218

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21219

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE

Model name: 2300 Flex HXP | Manufacturer: Lam Researchi

RMMT21247

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE