Electronic Equipment

Browse our inventory of electronic equipment. You can search using our search tool to the right. and add the specific equipment to “My Equipment List” and hit the “Request Info” button. We will then reach out to you to you as soon as possible.

  • Model Name: AXI-940B
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 08/08/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Metrology Equipment
  • Type: Thin Film Measurement System
  • Manufacturer: Onto Innovations
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE
  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: SINGAPORE