Electronic Equipment

Browse our inventory of electronic equipment. You can search using our search tool to the right. and add the specific equipment to “My Equipment List” and hit the “Request Info” button. We will then reach out to you to you as soon as possible.

  • Model Name: 2300 Flex FXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 13/12/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE
  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 11/04/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE
  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 11/04/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE
  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 11/04/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE
  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 11/04/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Oxide Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE
  • Model Name: 2300 Kiyo Poly
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 27/01/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE
  • Model Name: 2300 Kiyo Poly
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE
  • Model Name: ACT 12 SOD
  • Wafer Size: 300
  • Serial Number: J171778
  • Date Available: 31/07/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Resist Processing Equipment
  • Type: Cluster Tool Tracks (Resist Coater/Developer)
  • Manufacturer: TEL
  • Location: SINGAPORE
  • Model Name: Advanced Ace 300
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 24/02/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Traditional Furnaces / Diffusion Systems
  • Type: Vertical POLY Furnance
  • Manufacturer: Kokusai
  • Location: SINGAPORE
  • Model Name: Advanced Ace 300
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 30/04/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Traditional Furnaces / Diffusion Systems
  • Type: Vertical Diffusion Furnace
  • Manufacturer: Kokusai
  • Location: SINGAPORE
  • Model Name: Archer 600
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 07/05/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Metrology Equipment
  • Type: Overlay Measurement System
  • Manufacturer: KLA
  • Location: SINGAPORE
  • Model Name: Centris SYM3
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 17/01/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Multi-Process Etch
  • Manufacturer: Applied Materials
  • Location: SINGAPORE
  • Model Name: DFD6362
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 10/28/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Dicing Saw
  • Manufacturer: Disco
  • Location: MALAYSIA
  • Model Name: DFD6362
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 10/28/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Dicing Saw
  • Manufacturer: Disco
  • Location: MALAYSIA
  • Model Name: DFD6362
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Dicing Saw
  • Manufacturer: Disco
  • Location: MALAYSIA
  • Model Name: DFD6362
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Dicing Saw
  • Manufacturer: Disco
  • Location: MALAYSIA
  • Model Name: DFL7161
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 20/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Laser Dicing Saw
  • Manufacturer: Disco
  • Location: MALAYSIA
  • Model Name: DFL7361
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 02/04/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Laser Dicing Saw
  • Manufacturer: Disco
  • Location: MALAYSIA
  • Model Name: DFL7361
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 13/11/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Laser Dicing Saw
  • Manufacturer: Disco
  • Location: SINGAPORE