RMMT21267

  • Model Name: DFL7361
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 02/04/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Laser Dicing Saw
  • Manufacturer: Disco
  • Location: MALAYSIA