RMMT20979

  • Model Name: 2300 Flex HXP
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 09/05/2024
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Manufacturer: Lam Research
  • Location: SINGAPORE