RMMT20736

  • Model Name: Bestem D531t
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 19/12/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA