Electronic Equipment

Browse our inventory of electronic equipment. You can search using our search tool to the right. and add the specific equipment to “My Equipment List” and hit the “Request Info” button. We will then reach out to you to you as soon as possible.

  • Model Name: Hexa Maxx
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 06/01/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Inspection
  • Type: Automated Optical Inspection (AOI) System
  • Manufacturer: STI
  • Location: SINGAPORE
  • Model Name: Hydrilis Suprema
  • Wafer Size: 300
  • Serial Number: TBD
  • Date Available: 01/30/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: Stripper/Asher
  • Manufacturer: Mattson
  • Location: SINGAPORE
  • Model Name: I-Flex
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 15/07/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Hybrid Bonder
  • Manufacturer: Kulicke & Soffa
  • Location: SINGAPORE
  • Model Name: INDY Plus
  • Wafer Size: 300
  • Serial Number: TBD
  • Configuration: LP Oxide - H2O2 Rich WVG / D20
  • Date Available: 01/30/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Traditional Furnaces / Diffusion Systems
  • Type: Vertical Diffusion Furnace
  • Manufacturer: TEL
  • Location: SINGAPORE
  • Model Name: INDY Plus
  • Wafer Size: 300
  • Configuration: LP Oxide
  • Date Available: 01/30/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Traditional Furnaces / Diffusion Systems
  • Type: Vertical Diffusion Furnace
  • Manufacturer: TEL
  • Location: SINGAPORE
  • Model Name: INDY Plus - 4" Hi-Vac Line and 80k Pump Capacity Upgrade
  • Wafer Size: 300
  • Serial Number: TBD
  • Configuration: 4" Hi-Vac Line and 80k Pump Capacity Upgrade
  • Date Available: 01/30/2023
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Fabrication
  • Family: Traditional Furnaces / Diffusion Systems
  • Type: Vertical Oxide Furnace
  • Manufacturer: TEL
  • Location: SINGAPORE
  • Model Name: JTS-8500
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 10/02/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Printed Circuit Board Assembly
  • Family: Material Handling
  • Type: Conveyor & Material Handling Equipment
  • Manufacturer: JT Corp.
  • Location: SINGAPORE
  • Model Name: JTS-8500
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 10/02/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Printed Circuit Board Assembly
  • Family: Material Handling
  • Type: Conveyor & Material Handling Equipment
  • Manufacturer: JT Corp.
  • Location: SINGAPORE
  • Model Name: JTS-8500
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 10/02/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Printed Circuit Board Assembly
  • Family: Material Handling
  • Type: Conveyor & Material Handling Equipment
  • Manufacturer: JT Corp.
  • Location: SINGAPORE
  • Model Name: M6541AD
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 06/01/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Package Handling Equipment
  • Type: Gravity Feed Memory Handler
  • Manufacturer: Advantest
  • Location: SINGAPORE
  • Model Name: M6541AD
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 06/01/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Package Handling Equipment
  • Type: Gravity Feed Memory Handler
  • Manufacturer: Advantest
  • Location: SINGAPORE
  • Model Name: M6741AD
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 15/07/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Package Handling Equipment
  • Type: Pick and Place Memory Handler
  • Manufacturer: Advantest
  • Location: SINGAPORE
  • Model Name: M6741AD
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 15/07/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Package Handling Equipment
  • Type: Pick and Place Memory Handler
  • Manufacturer: Advantest
  • Location: SCOTLAND
  • Model Name: Magnum V GV
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 11/09/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Memory ATE
  • Type: DRAM Test System
  • Manufacturer: Teradyne
  • Location: MALAYSIA
  • Model Name: Magnum V GV
  • Wafer Size: N/A
  • Date Available: 10/02/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Test Systems
  • Type: Memory Verification Test System
  • Manufacturer: NEXTEST
  • Location: MALAYSIA
  • Model Name: Magnum V GV
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 12/11/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Memory ATE
  • Type: Flash Memory Test System
  • Manufacturer: NEXTEST
  • Location: MALAYSIA
  • Model Name: Magnum V GV
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 11/09/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Memory ATE
  • Type: DRAM Test System
  • Manufacturer: Teradyne
  • Location: MALAYSIA
  • Model Name: Magnum V GV
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 11/09/2025
  • Group: Electronic
  • Owner: Micron
  • Category: Automated Test Equipment
  • Family: Memory ATE
  • Type: DRAM Test System
  • Manufacturer: Teradyne
  • Location: MALAYSIA
  • Model Name: NPM-D3
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 09/03/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Package Handling Equipment
  • Type: Pick & Place Equipment
  • Manufacturer: Panasonic
  • Location: MALAYSIA
  • Model Name: NPM-D3
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 09/03/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Package Handling Equipment
  • Type: Pick & Place Equipment
  • Manufacturer: Panasonic
  • Location: MALAYSIA