RMMT21714

  • Model Name: Bestem D-02H
  • Wafer Size: N/A
  • Serial Number: TBD
  • Date Available: 09/03/2026
  • Group: Electronic
  • Owner: Micron
  • Category: Semiconductor Assembly & Packaging
  • Family: Bonding Equipment
  • Type: Epoxy Die Bonder
  • Manufacturer: Canon Machinery
  • Location: MALAYSIA